Title:
PACKAGE FOR ELECTRONIC ELEMENT
Document Type and Number:
WIPO Patent Application WO/1995/020244
Kind Code:
A1
Abstract:
A package for hermetically housing an electronic element has a lid made of metallic foil. The gap between the lid and the main body is sealed with a resin adhesive.
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Inventors:
KAWAURA SHIGEHIRO (JP)
Application Number:
PCT/JP1995/000049
Publication Date:
July 27, 1995
Filing Date:
January 19, 1995
Export Citation:
Assignee:
NIPPON CARBIDE KOGYO KK (JP)
KAWAURA SHIGEHIRO (JP)
KAWAURA SHIGEHIRO (JP)
International Classes:
H01C1/02; H01G4/224; H01L23/02; H01L23/04; H01L23/10; H03H9/02; H03H9/10; (IPC1-7): H01L23/04
Foreign References:
| JPS6066836A | 1985-04-17 | |||
| JPH04107955A | 1992-04-09 | |||
| JPH02271556A | 1990-11-06 |
Other References:
See also references of EP 0691680A4
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