Title:
PACKAGE ELEMENT FOR POWER SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2016/075985
Kind Code:
A1
Abstract:
A package element (10) is provided with power semiconductors (311, 312), a circuit board (20), a current-detecting resistor element (50), and a package resin (60). The power semiconductors (311, 312) are mounted on the top surface of the circuit board (20), and the resistor element (50) is mounted on the bottom surface of the circuit board (20). A conductor pattern (21) on which the power semiconductors (311, 312) are mounted is connected to a conductor pattern (22) on which the resistor element (50) is mounted via a conductive via-hole (201). The package resin (60) is a single package formed by molding the power semiconductors (311, 312) and the resistor element (50). The resistor element (50) is exposed from the package resin (60). The resistor element (50) radiates self-produced heat and heat propagating from the power semiconductors (311, 312) through the exposed area to the outside.
Inventors:
SATO TOMOHIKO (JP)
KASHIURA HIDEAKI (JP)
KASHIURA HIDEAKI (JP)
Application Number:
PCT/JP2015/074327
Publication Date:
May 19, 2016
Filing Date:
August 28, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L25/07; H01L25/18
Foreign References:
| JP2007180267A | 2007-07-12 | |||
| JP2009010082A | 2009-01-15 | |||
| JP2007218448A | 2007-08-30 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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