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Patent Searching and Data


Title:
PACKAGE FOR HEATING AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/154648
Kind Code:
A1
Abstract:
To provide: a package for heating, which is capable of heating a material to be heated in a short time, while avoiding the occurrence of heating unevenness, and which has improved handling properties; and a packaging material. A package (10) for heating, which is arranged between a first electrode (60) and a second electrode (61) and is heated by means of high-frequency dielectric heating. This package (10) for heating is configured from a material (20) to be heated and a packaging material (30); and the packaging material (30) comprises a first metal layer (50) that is arranged in a first facing surface (21), a second metal layer (51) that is arranged in a second facing surface (22), and a conduction part (52) that electrically connects the first metal layer (50) and the second metal layer (51) to each other. The first metal layer (50) has a first metal outer periphery covering part (50a) that covers the outer periphery of the first facing surface (21) and a first metal opening part (50b) that is formed inside the first metal outer periphery covering part (50a).

Inventors:
MARUYAMA TOMOKI (JP)
YAMADA SHINJI (JP)
Application Number:
PCT/JP2017/007602
Publication Date:
September 14, 2017
Filing Date:
February 28, 2017
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
A47J27/00; B65D81/34; H05B6/54
Domestic Patent References:
WO1999061346A11999-12-02
Foreign References:
JPH06237707A1994-08-30
JP2015159104A2015-09-03
JPS5614545B21981-04-04
JPH06193887A1994-07-15
JP2004135876A2004-05-13
JPS5985280A1984-05-17
JPS62133694A1987-06-16
JPH0383562A1991-04-09
JPS6024704B21985-06-14
Attorney, Agent or Firm:
FUJIMOTO Nobuo et al. (JP)
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