Title:
PACKAGE FOR HEATING AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/154648
Kind Code:
A1
Abstract:
To provide: a package for heating, which is capable of heating a material to be heated in a short time, while avoiding the occurrence of heating unevenness, and which has improved handling properties; and a packaging material.
A package (10) for heating, which is arranged between a first electrode (60) and a second electrode (61) and is heated by means of high-frequency dielectric heating. This package (10) for heating is configured from a material (20) to be heated and a packaging material (30); and the packaging material (30) comprises a first metal layer (50) that is arranged in a first facing surface (21), a second metal layer (51) that is arranged in a second facing surface (22), and a conduction part (52) that electrically connects the first metal layer (50) and the second metal layer (51) to each other. The first metal layer (50) has a first metal outer periphery covering part (50a) that covers the outer periphery of the first facing surface (21) and a first metal opening part (50b) that is formed inside the first metal outer periphery covering part (50a).
Inventors:
MARUYAMA TOMOKI (JP)
YAMADA SHINJI (JP)
YAMADA SHINJI (JP)
Application Number:
PCT/JP2017/007602
Publication Date:
September 14, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
A47J27/00; B65D81/34; H05B6/54
Domestic Patent References:
WO1999061346A1 | 1999-12-02 |
Foreign References:
JPH06237707A | 1994-08-30 | |||
JP2015159104A | 2015-09-03 | |||
JPS5614545B2 | 1981-04-04 | |||
JPH06193887A | 1994-07-15 | |||
JP2004135876A | 2004-05-13 | |||
JPS5985280A | 1984-05-17 | |||
JPS62133694A | 1987-06-16 | |||
JPH0383562A | 1991-04-09 | |||
JPS6024704B2 | 1985-06-14 |
Attorney, Agent or Firm:
FUJIMOTO Nobuo et al. (JP)
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