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Patent Searching and Data


Title:
PACKAGE FOR HOUSING ELEMENTS AND MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/029880
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a package for housing elements and a mounting structure that are capable of improving frequency characteristics in a high-frequency band. The package for housing elements (2) comprises a substrate (4), a frame (5), and an I/O terminal (6). The I/O terminal (6) has: a plurality of signal terminals (7) arranged along one direction; and a ground terminal (8) sandwiched between the plurality of signal terminals (7) and arranged along one direction. One end of the ground terminal (8) on the side close to the frame (5) is formed wider than the other end of the ground terminal on the side further away from the frame. A wide section (8a) of the ground terminal (8) is provided extending from an area overlapping the I/O terminal (6) to an area not overlapping the I/O terminal (6). The distance to the signal terminals (7) in the area not overlapping the I/O terminal (6) is short on one end side and long on the other end side.

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Inventors:
KAWAZU, Yoshiki (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2014/071923
Publication Date:
March 05, 2015
Filing Date:
August 21, 2014
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01L23/04; H01L23/02; H01P5/02; H01P5/08; H01R33/74
Foreign References:
JP2004193428A2004-07-08
JPH07161414A1995-06-23
JP2003069313A2003-03-07
JP2001144220A2001-05-25
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