Title:
PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/161660
Kind Code:
A1
Abstract:
A package (3) for housing a semiconductor element, the package (3) for housing a semiconductor element being provided with: a substrate (31) having on the upper surface a mounting region (R) for mounting a semiconductor element (2); a wiring conductor (32) formed on the substrate (31) from the mounting region (R) to the edge part of the substrate (31); a frame body (33) provided on the substrate (31) so as to surround the mounting region (R) and so that the edge part of the substrate (31) is exposed to the outer side of the frame body (33); and a connector member (34) provided on a side surface of the substrate (31) at a distance from the frame body (33) and electrically connected to the wiring conductor (32).
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Inventors:
TSUJINO MAHIRO (JP)
Application Number:
PCT/JP2013/061473
Publication Date:
October 31, 2013
Filing Date:
April 18, 2013
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/04; H01L23/08; H01R13/66; H01R33/76
Foreign References:
| JP2003258142A | 2003-09-12 | |||
| JP2009054667A | 2009-03-12 | |||
| JP2002076205A | 2002-03-15 |
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