Title:
PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2011/081249
Kind Code:
A1
Abstract:
A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing a stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device is provided. The method includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate that is exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line that is formed in an upper surface of the oxide layer.
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Inventors:
KIM KYOUNG-MIN (KR)
KIM JUNG-HYUN (KR)
KIM JUNG-HYUN (KR)
Application Number:
PCT/KR2010/000953
Publication Date:
July 07, 2011
Filing Date:
February 16, 2010
Export Citation:
Assignee:
WAVENICS INC (KR)
KIM KYOUNG-MIN (KR)
KIM JUNG-HYUN (KR)
KIM KYOUNG-MIN (KR)
KIM JUNG-HYUN (KR)
International Classes:
H01L23/40
Foreign References:
| US20050051789A1 | 2005-03-10 | |||
| US20060246617A1 | 2006-11-02 | |||
| JPH0513616A | 1993-01-22 | |||
| JPH06204355A | 1994-07-22 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (649-10Yoksam-dong, Kangnam-ku, Seoul 135-080, KR)
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