PACKAGE FOR PHOTOSENSORS, PHOTOSENSOR DEVICE AND ELECTRONIC MODULE

Title:

PACKAGE FOR PHOTOSENSORS, PHOTOSENSOR DEVICE AND ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO/2018/012621

Kind Code:

A1

Abstract:

This package for photosensors comprises a wiring board and a plurality of external connection conductors that are provided on the wiring board. The wiring board has: a first main surface and a second main surface that is on the reverse side of the first main surface; a first pore and a second pore, which penetrate therethrough from the first main surface to the second main surface; a recess formed in the second main surface, by which the first pore and the second pore are in communication with each other; a first opening of the first pore, which is on the first main surface side, and a second opening of the first pore, which is on the second main surface side; and a third opening of the second pore, which is on the first main surface side, and a fourth opening of the second pore, which is on the second main surface side. A light receiving element having a light receiving part is contained in the recess; and a light emitting element having a light emitting part is contained in the fourth opening.

Inventors:

NAKAMOTO KOUTAROU (JP)

Application Number:

PCT/JP2017/025754

Publication Date:

January 18, 2018

Filing Date:

July 14, 2017

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01L31/12

Foreign References:

JP2013131601A	2013-07-04
JP2004063764A	2004-02-26
JP2016001674A	2016-01-07
JP2000322989A	2000-11-24
US20130019459A1	2013-01-24

Other References: