PACKAGE FOR PRESSURE SENSOR, AND PRESSURE SENSOR USING THE PACKAGE

Title:

PACKAGE FOR PRESSURE SENSOR, AND PRESSURE SENSOR USING THE PACKAGE

Document Type and Number:

WIPO Patent Application WO/2010/122883

Kind Code:

A1

Abstract:

In one embodiment of a package for a pressure sensor, the side surface of a first protruding section disposed on the main surface of an insulating base body and the side surface of a second protruding section disposed on the rear surface of a case are bonded by means of a bonding member. Thus, since significant plastic deformation of the bonding member is suppressed, measuring accuracy of the pressure sensor can be highly accurately maintained.

Inventors:

MIYAWAKI, Kiyoshige (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
宮脇　清茂 (〒01 京都府京都市伏見区竹田鳥羽殿町６番地　京セラ株式会社内 Kyoto, 〒6128501, JP)
UEDA, Yoshiaki (Shiga Gamo Plant 10-1 Kawai-cho, Higashiomi-sh, Shiga 95, 〒5291595, JP)
植田　義明 (〒95 滋賀県東近江市川合町１０－１　京セラ株式会社滋賀蒲生工場内 Shiga, 〒5291595, JP)

Application Number:

JP2010/055802

Publication Date:

October 28, 2010

Filing Date:

March 31, 2010

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Assignee:

KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
京セラ株式会社 (〒01 京都府京都市伏見区竹田鳥羽殿町６番地 Kyoto, 〒6128501, JP)
MIYAWAKI, Kiyoshige (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
宮脇　清茂 (〒01 京都府京都市伏見区竹田鳥羽殿町６番地　京セラ株式会社内 Kyoto, 〒6128501, JP)
UEDA, Yoshiaki (Shiga Gamo Plant 10-1 Kawai-cho, Higashiomi-sh, Shiga 95, 〒5291595, JP)

International Classes:

G01L19/14; G01L9/12

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