Title:
PACKAGE FOR STORING ELECTRONIC COMPONENT ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2012/060341
Kind Code:
A1
Abstract:
[Problem] To provide a package for storing electronic component elements, said package making it is possible to guarantee the bending strength of a ceramic substrate and the metalized joint strength of a metalized layer. [Solution] A package (10) for storing electronic component elements, said package comprising a ceramic substrate (11) and a metalized layer (12), wherein the package for storing electronic component elements is characterized in that: the ceramic composition of the ceramic substrate (11) contains 10 to 30 wt% of yttria partially-stabilized zirconia and 1.5 to 4.5 wt% of a sintering auxiliary agent formed from a combination of magnesia and at least one selected from silica, calcia, and manganese oxide, with the balance being alumina; the metalized composition of the metalized layer (12) contains 70 to 94 wt% of tungsten, 3 to 20 wt% of molybdenum, and 3 to 20 wt% of a ceramic component; and the ratio of tetragonal crystals in the zirconia crystals of the ceramic substrate (11) after co-firing is 60% or greater.
Inventors:
NAGAHIRO MASANORI (JP)
Application Number:
PCT/JP2011/075109
Publication Date:
May 10, 2012
Filing Date:
October 31, 2011
Export Citation:
Assignee:
SUMITOMO METAL SMI ELECTRONICS DEVICES INC (JP)
NAGAHIRO MASANORI (JP)
NAGAHIRO MASANORI (JP)
International Classes:
H01L23/15; H01L23/08
Domestic Patent References:
| WO2010114126A1 | 2010-10-07 |
Foreign References:
| JPH0613481B2 | 1994-02-23 | |||
| JPH0738014B2 | 1995-04-26 |
Other References:
See also references of EP 2637204A4
Attorney, Agent or Firm:
INOUE, HIROSHI (JP)
Hiroshi Inoue (JP)
Hiroshi Inoue (JP)
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Claims: