Title:
PACKAGE FOR STORING MINUTE SOLDER BALL AND METHOD FOR STORING MINUTE SOLDER BALL
Document Type and Number:
WIPO Patent Application WO/2010/064385
Kind Code:
A1
Abstract:
Degradation of a minute solder ball during storage, such as oxidation or deformation, is prevented. Containers (2) formed from a breathable material are filled with minute solder balls. A deoxidizing desiccating agent (3) is prepared for application outside the containers (2). The containers (2) and the deoxidizing desiccating agent (3) are housed in a non-breathable bag member (4), which is hermetically sealed. Air may be removed from the bag member (4) before the bag member (4) is sealed. The relative positions of the containers (2) may be fixedly maintained by means of a retaining member (5).
Inventors:
SATO, Isamu (23, Senju Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
佐藤勇 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
SOUMA, Daisuke (23, Senju Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
佐藤勇 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
SOUMA, Daisuke (23, Senju Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
Application Number:
JP2009/006383
Publication Date:
June 10, 2010
Filing Date:
November 26, 2009
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO., LTD. (23 Senju Hashido-cho, Adachi-ku Tokyo, 55, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
SATO, Isamu (23, Senju Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
佐藤勇 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
千住金属工業株式会社 (〒55 東京都足立区千住橋戸町２３番地 Tokyo, 〒1208555, JP)
SATO, Isamu (23, Senju Hashido-cho, Adachi-k, Tokyo 55, 〒1208555, JP)
佐藤勇 (〒55 東京都足立区千住橋戸町２３番地 千住金属工業株式会社内 Tokyo, 〒1208555, JP)
International Classes:
B65D77/04; B65D77/26; B65D81/03; B65D81/20; B65D81/26; B65D85/50
Attorney, Agent or Firm:
ONO, Shinjiro et al. (YUASA AND HARA, Section 206 New Ohtemachi Bldg.,2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, 〒1000004, JP)
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