PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD

Title:

PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/217319

Kind Code:

A1

Abstract:

The present application provides a package structure, an electronic device, and a chip packaging method. The package structure comprises a substrate, a chip, a support portion, and a thermally conductive cover plate. The chip is mounted on a surface of the substrate, and the thermally conductive cover plate is disposed on a side of the chip facing away from the substrate. A filling region opposite to the chip is provided on a surface of the thermally conductive cover plate facing the substrate, and has an accommodation recess provided with an opening facing the substrate. A thermal interface material layer is filled between the chip and a bottom surface of the accommodation recess. A first gap communicating with the accommodation recess is present between the substrate and an edge of the opening of the accommodation recess. During preparation of the package structure, the opening of the accommodation recess faces upwards, allowing a filling material to be poured from a pipe into the accommodation recess via the first gap. The filling material covers a side surface of the thermal interface material layer, so as to isolate the side surface from the air. In this way, the thermal interface material layer does not easily react with ingredients in the air and does not degenerate, thus ensuring good thermal contact between the chip and the thermally conductive cover plate, and facilitating stable heat dissipation of the chip.

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Inventors:

ZHENG JIANTAO (CN)
ZHAO NAN (CN)
CHIANG SHANGHSUAN (CN)
JIANG YU (CN)
LU JIANBIAO (CN)
REN YIWEI (CN)

Application Number:

PCT/CN2020/087091

Publication Date:

November 04, 2021

Filing Date:

April 26, 2020

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

H01L23/367; H01L21/00

Foreign References:

US8921994B2	2014-12-30
CN203456452U	2014-02-26
CN102456638A	2012-05-16
US20060120051A1	2006-06-08

Attorney, Agent or Firm:

TDIP & PARTNERS (CN)

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