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Patent Searching and Data


Title:
PACKAGE STRUCTURE, ELECTRONIC DEVICE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/196598
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application are a package structure, comprising a first substrate, a second substrate and a chip, wherein the second substrate is mounted on the upper surface of the first substrate, and the chip is mounted on the first substrate; the upper surface of the first substrate is provided with spaced protrusions thereon, and a lower surface of the second substrate is provided with spaced protrusions; the protrusions on the first substrate and the second substrate are opposite to each other and form a bonding region and an antenna region used for accommodating an antenna radiator between the first substrate and the second substrate; the second substrate is provided thereon with a through hole which is in communication with the bonding region; and bonding gel in the through hole and the bonding region overflows from the bonding region into the through hole and is solidified into a rivet structure. The described through hole prevents the bonding gel from overflowing and contaminating the antenna region during packaging, thereby ensuring the antenna performance of the package structure, and thus improving the reliability of the package structure. Also provided in the present invention are an electronic device and a packaging method.

Inventors:
CHANG MING (CN)
LIN LAICUN (CN)
LIU LIANGSHENG (CN)
QU HENG (CN)
Application Number:
PCT/CN2019/078509
Publication Date:
October 17, 2019
Filing Date:
March 18, 2019
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/488
Foreign References:
CN102007519A2011-04-06
CN102197475A2011-09-21
CN101785097A2010-07-21
US9620464B22017-04-11
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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