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Patent Searching and Data


Title:
PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/024569
Kind Code:
A1
Abstract:
Provided by the present disclosure are a package structure and a fabrication method therefor, and a display device. The package structure comprises a substrate, an organic electroluminescent component that is disposed on the substrate, and an encapsulation film layer that is disposed on the organic electroluminescent component, the encapsulation film layer encapsulating the organic electroluminescent component on the substrate; an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.

Inventors:
GE, Lin (No.9 Dize Rd, BDA, Beijing 6, 100176, CN)
Application Number:
CN2018/087129
Publication Date:
February 07, 2019
Filing Date:
May 16, 2018
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO., LTD. (No.10 Jiuxianqiao Rd, Chaoyang District, Beijing 5, 100015, CN)
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. (No.1188, Hezuo Rd. , Hi-tech Development Zon, Chengdu Sichuan 1, 611731, CN)
International Classes:
H01L51/52
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CHEN, Yuan10th Floor, Tower D, Minsheng Financial Center, 28 Jianguomennei Avenue, Dongcheng District, Beijing 5, 100005, CN)
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