PACKAGE STRUCTURE AND PACKAGING METHOD, ELECTRONIC DEVICE AND PACKAGING FILM RECYCLING METHOD

Title:

PACKAGE STRUCTURE AND PACKAGING METHOD, ELECTRONIC DEVICE AND PACKAGING FILM RECYCLING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/076321

Kind Code:

A1

Abstract:

Provided are a package structure and a packaging method, an electronic device and a packaging film recycling method. The package structure (10) is used to package a functional device (2) and comprises: a package film layer (5) and an adhesive stripping layer (4); the pakage film layer (5) is arranged to cover the functional device (2); the adhesive stripping layer (4) is bonded between the package film layer (5) and the functional device (2), and has a changeable viscosity for assisting the stripping of the package film layer (5). The package structure and method facilitate recycling of resources and reducing production costs.

Inventors:

HAN JUNQI (CN)
HU YOUYUAN (CN)
WANG XINZHU (CN)

Application Number:

PCT/CN2018/110674

Publication Date:

April 25, 2019

Filing Date:

October 17, 2018

Export Citation:

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Assignee:

BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)

International Classes:

H01L51/52; H01L27/32

Foreign References:

CN104992955A	2015-10-21
CN107011816A	2017-08-04
CN207517735U	2018-06-19
CN101488463A	2009-07-22
CN201710976138A	2017-10-19

Other References: