Title:
PACKAGE STRUCTURE FOR PATCH
Document Type and Number:
WIPO Patent Application WO/2017/094491
Kind Code:
A1
Abstract:
[Problem] To provide a package structure for a patch, said package structure being capable of preventing a decrease in the patch performance of the patch and vaporization of a percutaneous absorption component therein while holding openability of the package structure, having a broad sealable temperature range, and scarcely showing an adhesion failure even in the case where foreign matters adhere to a heat sealing surface, i.e., having excellent foreign matter-sealing properties.
[Solution] A package structure for packaging a patch in a packaging material, wherein: the innermost layer of the packaging material of the package structure is a heat-sealable resin layer containing an olefin resin; a resin layer containing a cyclic polyolefin resin is disposed outside the heat-sealable resin layer; and the heat-sealable resin layer is directly laminated on the resin layer containing the cyclic polyolefin resin. Due to this package structure, the vaporization of an active component, etc. can be appropriately prevented and a broad sealable temperature range and appropriate foreign matter-sealing properties can be established.
Inventors:
MATSUBARA HIROAKI (JP)
KOBASHI KAZUNORI (JP)
SYOUJI KENTO (JP)
KOBASHI KAZUNORI (JP)
SYOUJI KENTO (JP)
Application Number:
PCT/JP2016/083763
Publication Date:
June 08, 2017
Filing Date:
November 15, 2016
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B65D65/40; A61J1/00; B32B27/00; B32B27/32
Foreign References:
| JP2013248742A | 2013-12-12 | |||
| JP2015113124A | 2015-06-22 | |||
| JP2015030464A | 2015-02-16 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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