Title:
PACKAGE STRUCTURE OF SEMICONDUCTOR COMPONENT AND PACKAGING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/041294
Kind Code:
A1
Abstract:
A package structure of a semiconductor component, comprising a cylindrical substrate (6), an externally threaded structure (3) being provided on the outer circumference of the cylinder; a chip (4) provided on the substrate; an electrode (5) to be electrically connected to the chip; a transparent cover (1), the inner wall of the transparent cover being provided with an internally threaded structure (2) corresponding to the externally threaded structure of the substrate so that the transparent cover is in threaded connection with the substrate; and a metal sealing layer is provided at the threaded connection of the externally threaded structure and the internally threaded structure. In the package structure, the transparent cover and the substrate are in threaded connection by means of the threaded structures, thereby improving the convenience and fastening of the packaging process; and a sealant or a metal is used for implementing sealing or a metal eutectic is formed, thus improving the sealing effect, avoiding the problem of easy deterioration of an organic sealant due to heat or illumination, and improving the stability of the package structure.
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Inventors:
HE ZONGJIANG (CN)
JIA ZHIQIANG (CN)
JIA ZHIQIANG (CN)
Application Number:
PCT/CN2017/100122
Publication Date:
March 07, 2019
Filing Date:
September 01, 2017
Export Citation:
Assignee:
SHENZHEN QIANHAI XIAOYOU TECH CO LTD (CN)
SHENZHEN UVEI SILICON CO LTD (CN)
SHENZHEN UVEI SILICON CO LTD (CN)
International Classes:
H01L33/48
Foreign References:
| CN102324425A | 2012-01-18 | |||
| CN203910863U | 2014-10-29 | |||
| CN206163518U | 2017-05-10 | |||
| CN101872826A | 2010-10-27 | |||
| CN103715331A | 2014-04-09 | |||
| JP2012033855A | 2012-02-16 |
Attorney, Agent or Firm:
SHENZHEN CHINA INNOVATION SOUTH INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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