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Patent Searching and Data


Title:
PACKAGE STRUCTURE FOR SOUND ABSORBING PARTICLES AND SPEAKER MODULE
Document Type and Number:
WIPO Patent Application WO/2019/119943
Kind Code:
A1
Abstract:
The present utility model relates to a package structure for sound absorbing particles and a speaker module, comprising: a package shell, the package shell forming an open accommodating area, the accommodating area comprising a first transparent surface and a second transparent surface; a first breathable mesh and a second breathable mesh, the first breathable mesh being encapsulated on the first transparent surface, the second breathable mesh being encapsulated on the second transparent surface, and the first breathable mesh and the second breathable mesh enclosing the accommodating area; and sound absorbing particles, disposed in the accommodating area which is surrounded by the shell, the first breathable mesh and the second breathable mesh. One technical effect achieved by the present utility model is improving the packaging mode for sound absorbing particles.

Inventors:
ZHU BENCHAO (CN)
HAO ZHENGEN (CN)
Application Number:
PCT/CN2018/110214
Publication Date:
June 27, 2019
Filing Date:
October 15, 2018
Export Citation:
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Assignee:
GOERTEK TECH CO LTD (CN)
International Classes:
H04R1/20
Domestic Patent References:
WO2015037977A22015-03-19
Foreign References:
CN207869334U2018-09-14
CN105828262A2016-08-03
CN107454520A2017-12-08
CN206302557U2017-07-04
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