Title:
PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/199420
Kind Code:
A1
Abstract:
Provided are an package substrate, a semiconductor device and an electronic apparatus, which reduce crosstalk between chip pins and also improve the utilization rate of the pins to reduce the package area and thus reduce the development cost of the semiconductor device. The package substrate comprises a substrate body and a plurality of unit regions arranged on the substrate body, each unit region comprising two first solder ball structures, each of which comprises six first solder balls, which are arranged in rows of two solder balls to form a first row of solder balls, a second row of solder balls and a third row of solder balls, which are parallel to each other, wherein the four first solder balls in the first row of solder balls and the second row of solder balls are respectively located at four vertexes of a parallelogram; the four first solder balls in the second row of solder balls and the third row of solder balls are respectively located at four vertexes of another parallelogram; and the two parallelograms are arranged in an axial symmetry manner relative to the second row of solder balls.
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Inventors:
PENG XIPING (CN)
YUAN ZHENHUA (CN)
YUAN ZHENHUA (CN)
Application Number:
PCT/CN2022/080813
Publication Date:
September 29, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/498; H01L23/31; H01L23/488
Foreign References:
| CN107393898A | 2017-11-24 | |||
| US20030052417A1 | 2003-03-20 | |||
| CN106206515A | 2016-12-07 | |||
| US20170025345A1 | 2017-01-26 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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