Title:
PACKAGE SUBSTRATE FOR SENSOR, SENSOR MODULE INCLUDING SAME, AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE FOR SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/039888
Kind Code:
A1
Abstract:
[Problem] To suppress the infiltration of foreign matter through a through-hole in a package substrate for a sensor having the through-hole. [Solution] A package substrate 100 for a sensor has a through-hole V that is provided at a position overlapping a sensor chip mounting area A in a plan view, and penetrates a region from one surface 101 to the other surface 102. The through-hole V has a first section V1 exposed to the one surface 101 side, a second section V2 exposed to the other surface 102 side, and a third section V3 connecting the first section V1 and the second section V2. The first section V1 and the second section V2 do not at least partially overlap each other in a plan view, and the third section V3 overlaps the entirety of the first and second sections V1, V2 in a plan view. In this way, since the through-hole V is divided into the first to third sections V1 to V3, it becomes difficult for foreign matter that infiltrates through the through-hole V to reach the sensor chip mounting area A.
Inventors:
TSUYUTANI KAZUTOSHI (JP)
Application Number:
PCT/JP2020/032313
Publication Date:
March 04, 2021
Filing Date:
August 27, 2020
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01L23/02; G01L19/14; H05K1/02; H05K3/46
Foreign References:
| CN110049419A | 2019-07-23 | |||
| CN110113687A | 2019-08-09 | |||
| CN206348098U | 2017-07-21 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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