Title:
PACKAGE TYPE PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING PACKAGE TYPE PIEZOELECTRIC VIBRATOR
Document Type and Number:
WIPO Patent Application WO/2008/102900
Kind Code:
A1
Abstract:
Provided is a package type piezoelectric vibrator which is capable of being packaged
at a wafer level and is suitable for mass production. The package type crystalline
vibrator has a structure wherein an extraction electrode exists by having an
extraction electrode adhered between a step surface and a lower surface of a frame
section of a piezoelectric substrate when a base body is bonded on a lower surface
side of the piezoelectric substrate, and a space of a recessed section of the base
body is hermetically sealed. Therefore, the piezoelectric substrate can be
hermetically sealed easily and the manufacture process is prevented from being
complicated, only by bonding a case body on the upper surface side of the piezoelectric
substrate and bonding the base body on the lower surface side of the dielectric
substrate.
More Like This:
| JPH03228415 | CRYSTAL OSCILLATOR |
| JP2013207686 | CRYSTAL OSCILLATOR |
Inventors:
TAKAHASHI TAKEHIRO (JP)
Application Number:
PCT/JP2008/053126
Publication Date:
August 28, 2008
Filing Date:
February 19, 2008
Export Citation:
Assignee:
NIHON DEMPA KOGYO CO (JP)
TAKAHASHI TAKEHIRO (JP)
TAKAHASHI TAKEHIRO (JP)
International Classes:
H03H9/02; H01L23/04; H01L41/09; H01L41/18; H03H3/02; H03H9/10
Foreign References:
| JPH10209799A | 1998-08-07 | |||
| JPH10209795A | 1998-08-07 |
Attorney, Agent or Firm:
INOUE, Toshio (3-29 Sumiyoshi-cho,Naka-ku, Yokohama-shi, Kanagawa 13, JP)
Download PDF: