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Patent Searching and Data


Title:
PACKAGE WITH ATTACHED WIRELESS IC TAG AND MANUFACTURING METHOD FOR PACKAGE WITH ATTACHED WIRELESS IC TAG
Document Type and Number:
WIPO Patent Application WO/2015/020042
Kind Code:
A1
Abstract:
 A package with an attached wireless IC tag provided with: a package part having a metallic sheet on which a predetermined slot pattern is formed and a resin sheet; and an IC chip part provided with an IC chip and an electrode element to supply electric power to the IC chip. The end part of the slot pattern is arranged on a corner region of the package part.

Inventors:
OKAMOTO, Yoichi (3-6, Nakamagome 1-chom, Ohta-ku Tokyo 55, 〒1438555, JP)
KAWASE, Tsutomu (3-6, Nakamagome 1-chom, Ohta-ku Tokyo 55, 〒1438555, JP)
Application Number:
JP2014/070601
Publication Date:
February 12, 2015
Filing Date:
August 05, 2014
Export Citation:
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Assignee:
RICOH COMPANY, LTD. (3-6 Nakamagome 1-chome, Ohta-ku Tokyo, 55, 〒1438555, JP)
OKAMOTO, Yoichi (3-6, Nakamagome 1-chom, Ohta-ku Tokyo 55, 〒1438555, JP)
KAWASE, Tsutomu (3-6, Nakamagome 1-chom, Ohta-ku Tokyo 55, 〒1438555, JP)
International Classes:
H01Q13/10; B65D75/32; G06K19/00; G06K19/07; G06K19/077
Domestic Patent References:
WO2008000279A12008-01-03
Foreign References:
JP2007060407A2007-03-08
JP2009269637A2009-11-19
JP2013037653A2013-02-21
JP2010534363A2010-11-04
JP2007060407A2007-03-08
Attorney, Agent or Firm:
ITOH, Tadashige et al. (16th Floor, Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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