Title:
PACKAGED ACOUSTIC AND ELECTROMAGNETIC TRANSDUCER CHIPS
Document Type and Number:
WIPO Patent Application WO2005086532
Kind Code:
A3
Abstract:
Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.
Inventors:
HUMPSTON GILES (US)
OSBORN PHILIP R (US)
THOMPSON JESSE BURL (US)
KUBOTA YOICHI (US)
TSENG CHUNG-CHUAN (US)
BURTZLAFF ROBERT (US)
HABA BELGACEM (US)
TUCKERMAN DAVID B (US)
WARNER MICHAEL (US)
OSBORN PHILIP R (US)
THOMPSON JESSE BURL (US)
KUBOTA YOICHI (US)
TSENG CHUNG-CHUAN (US)
BURTZLAFF ROBERT (US)
HABA BELGACEM (US)
TUCKERMAN DAVID B (US)
WARNER MICHAEL (US)
Application Number:
PCT/US2005/006565
Publication Date:
January 26, 2006
Filing Date:
March 01, 2005
Export Citation:
Assignee:
TESSERA INC (US)
HUMPSTON GILES (US)
OSBORN PHILIP R (US)
THOMPSON JESSE BURL (US)
KUBOTA YOICHI (US)
TSENG CHUNG-CHUAN (US)
BURTZLAFF ROBERT (US)
HABA BELGACEM (US)
TUCKERMAN DAVID B (US)
WARNER MICHAEL (US)
HUMPSTON GILES (US)
OSBORN PHILIP R (US)
THOMPSON JESSE BURL (US)
KUBOTA YOICHI (US)
TSENG CHUNG-CHUAN (US)
BURTZLAFF ROBERT (US)
HABA BELGACEM (US)
TUCKERMAN DAVID B (US)
WARNER MICHAEL (US)
International Classes:
B81B7/00; H01L23/495; H04R19/00; H04R19/04; (IPC1-7): B81B7/00
Foreign References:
| US20030133588A1 | 2003-07-17 | |||
| US20020102004A1 | 2002-08-01 | |||
| US6674159B1 | 2004-01-06 | |||
| US6140144A | 2000-10-31 | |||
| US20030052404A1 | 2003-03-20 | |||
| US20020089835A1 | 2002-07-11 | |||
| US20030128854A1 | 2003-07-10 | |||
| US5448014A | 1995-09-05 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 10 31 October 1997 (1997-10-31)
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