PACKAGED THERMOELECTRIC CONVERSION MODULE

WIPO Patent Application WO/2010/084718

A1

A packaged thermoelectric conversion module wherein a pressurizing mechanism or coating with a heat-conductive grease for reducing thermal contact resistance is not required between a thermoelectric conversion module sealed in an airtight container and a heat source. In a packaged thermoelectric conversion module (1) wherein the interior of the airtight container (13) accommodating the thermoelectric conversion module (5) is decompressed or evacuated, the interior of the airtight container (13) is partitioned with a partition plate (7) into two chambers (14, 17). One of the chambers (17) is provided with the thermoelectric conversion module (5) and electrodes (9a, 9b) led out to the outside of the airtight container (13), while a flow path (16) for introducing a heating medium (26 or 25) from an external heating medium supply source and circulating the heating medium between the chamber (14) and the external heating medium supply source is formed in the other chamber (14). While transferring heat to one surfaces of thermoelectric semiconductors (2) by the heating medium (26 or 25) via the partition plate (7), heat is transferred between the other surfaces of thermoelectric semiconductors (2) and an external heat source via the airtight container (13).

KAMBE, Mitsuru (11-1 Iwadokita 2-chome, Komae-sh, Tokyo 11, 〒2018511, JP)

JP2010/000185

July 29, 2010

January 14, 2010

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CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY (6-1 Otemachi 1-chome, Chiyoda-ku Tokyo, 26, 〒1008126, JP)
財団法人電力中央研究所 (〒26 東京都千代田区大手町１丁目６番１号 Tokyo, 〒1008126, JP)

H01L35/30; H02N11/00

MURASE, Kazumi (KOHNO TORANOMON BUILDING 2F, 8-5 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)

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