Title:
PACKAGING ASSEMBLY, PREPARATION METHOD THEREFOR AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/184072
Kind Code:
A1
Abstract:
Disclosed in the present application are a packaging assembly, a preparation method therefor and a display device, the packaging assembly comprising: at least one packaging unit, the packaging unit comprising a first inorganic layer, a second inorganic layer and an organic layer that are stacked in sequence, wherein the materials of the first inorganic layer and the second inorganic layer are different. By means of the described method, the present invention may reduce the number of holes at inner parts of film layers, increase the density of film layers, effectively block moisture, and enhance a packaging effect.
Inventors:
YU MING-JIUE (CN)
Application Number:
PCT/CN2018/087857
Publication Date:
October 03, 2019
Filing Date:
May 22, 2018
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L27/32; H01L51/52
Foreign References:
| CN101577317A | 2009-11-11 | |||
| CN203165953U | 2013-08-28 | |||
| CN106299153A | 2017-01-04 | |||
| CN106098733A | 2016-11-09 | |||
| CN107123753A | 2017-09-01 | |||
| KR20170006344A | 2017-01-18 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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