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Patent Searching and Data


Title:
PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2011/155290
Kind Code:
A1
Abstract:
Provided is a packaging body (13) for packing a stacked body (11) formed by folding a band-shaped material (10) in zigzag manner. The band-shaped material (10) includes a release sheet (RL) and a label (L) temporarily attached to the release sheet (RL). The packaging body (13) is provided in such a way that the stacked body (11) is enfolded in a state in which an end edge surface (11B) of the stacked body (11) is supported, that the band-shaped material (10) can be transported without the stacked state of the band-shaped material (10) collapsing, and that the packaging body (13) can be fitted to a paper feeding section etc. of a label attaching apparatus (50). Grip portions (20) are provided which can be located higher than a start edge surface at which the start edge of the band-shaped material (10) is located.

Inventors:
FUJITA Toshihiro (23-23 Honcho, Itabashi-k, Tokyo 01, 〒1730001, JP)
Application Number:
JP2011/061162
Publication Date:
December 15, 2011
Filing Date:
May 16, 2011
Export Citation:
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Assignee:
LINTEC CORPORATION (23-23, Honcho Itabashi-k, Tokyo 01, 〒1730001, JP)
リンテック株式会社 (〒01 東京都板橋区本町23-23 Tokyo, 〒1730001, JP)
International Classes:
B65D83/08; B65D73/02; B65D75/40; B65D85/67
Attorney, Agent or Firm:
YAMAGUCHI Yoshio (8th Floor, Izumi Building 4-17, Tsurumaki 1-chome, Tama-sh, Tokyo 34, 〒2060034, JP)
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Claims: