PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Title:

PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/018156

Kind Code:

A1

Abstract:

The present application relates to the field of electronic technology. Provided are a packaging device and a manufacturing method therefor, and an electronic device, which are used for solving the problem that pins of the packaging device are located on a side face, and increase the area of the packaging device, being disadvantageous to reducing the weight and volume of the electronic device. The packaging device comprises: a circuit board having a first surface; a first plastic packaging layer covering the first surface, the first plastic packaging layer comprising at least one first channel, the first channel running through the first plastic packaging layer in a first direction, and the first direction being a direction perpendicular to the first surface; and at least one first pin electrically connected to the circuit board, a first pin being located within a first channel, at least a portion of the first pin being connected to the inner wall of the first channel, the first channel exposing a first conductive surface of the first pin away from the circuit board, and the first pin being electrically connected to an external device by means of the first conductive surface.

Inventors:

PAN WEIJIAN (CN)
HU ZHIXIANG (CN)
YE GANG (CN)

Application Number:

PCT/CN2020/105303

Publication Date:

February 04, 2021

Filing Date:

July 28, 2020

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

H01L23/31; H01L23/48; H01L23/49

Foreign References:

US20130241053A1	2013-09-19
CN107546217A	2018-01-05
CN104332457A	2015-02-04
US20150145123A1	2015-05-28
CN2904298Y	2007-05-23
CN106601630A	2017-04-26
CN201910696888A	2019-07-30

Other References: