| JP08230835 | APAPRATUS FOR FIXING LONGITUDINAL SEAM WELD ON TUBULAR PACKAGING MATERIAL |
| WO/2011/060460 | METHOD FOR CLOSING A BAG BODY |
| WO/1986/002229 | POWER PACK USING MICROWAVE ENERGY FOR HEATING |
OUYANG, Chu (8 Xing Yi Road Maxdo Centre, 38/FShanghai, 6, 200336, CN)
| What is claimed is:
1. A packaging device for electronic components, comprising: a carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; and a cover tape covering the carrier tape; wherein the cover tape is bonded along two outer bonding portions to the edge surfaces of the carrier tape by laser irradiation heat fusion, so that a laser irradiated heat fusion area is formed to package the electronic components placed in the pockets.
2. The packaging device for the electronic components of claim 1 , wherein the cover tape is a transparent conductive or static dissipative film.
3. The packaging device for the electronic components of claim 2, wherein the cover tape comprises; a base film; a conductive layer or anti-electrostatic coating layer provided on at least one side of the base film; and a protecting layer provided on the conductive layer or anti-electrostatic coating layer, to protect the electronic components from abrasion.
4. The packaging device for the electronic components of claim 1 , wherein the cover tape is provided with longitudinal score lines at an inner side of the laser irradiated heat fusion area.
5. The packaging device for the electronic components of claim 4, wherein the cover tape is provided with spaced periodic tearing guide nicks extended laterally from the score lines at the outer side of the score lines.
6. The packaging device for the electronic components of claim 5, wherein the guiding nicks are formed at an angle of about 45 degrees with respect to the score lines.
7. A packing method for electronic components, comprising: transporting a carrier tape, the carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets, wherein the cover tape optionally may include longitudinal score lines on a surface of an inner side of the cover tape; placing a plurality of electronic components in the pockets respectively; covering the carrier tape with the pockets being provided with the electronic components by a cover tape; and bonding both sides of the cover tape to the pair of edge surfaces of the carrier tape by laser irradiation heat fusion, so that a laser heat sealing area is formed to package the electronic components placed in the pockets.
8. The packing method for electronic components of claim 7, further comprising: forming tearing guide nicks laterally extended from the score lines on the cover tape at an outer side of the score lines.
9. A packaging system for electronic components, comprising: a first winding roller wound with carrier tape, the carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; a loading device provided downstream of the first winding roller, for loading electronic components in the pockets of the carrier tape unwound from the first winding roller, optionally wherein the loading device includes a suction nozzle for detachably sucking the electronic components being packaged; a second winding roller provided downstream of the loading device, and a cover tape being wound thereon; an applicator block provided downstream of the second winding roller, for securing the cover tape unwound from the second winding roller on the carrier tape with the pockets being provided with the electronic components; and a laser beam generating device provided downstream of the applicator block, the laser beam emitted from the laser beam generating device irradiating the edge surfaces of the carrier tape to bond the cover tape on both edge surfaces of the carrier tape; and optionally further comprising a third winding roller to wind the carrier tape and the cover tape after bonding these together.
10. The packaging apparatus for electronic components of claim 9, further comprising: providing a platform under the applicator block for supporting the carrier tape when the carrier tape is covered with the cover tape by the applicator block. |
PACKAGING DEVICE, METHOD, AND APPARATUS FOR ELECTRONIC COMPONENTS
Background Field of the Invention
The present invention relates to packaging device for electronic components, more specifically, to packaging device for electronic components in which a cover tape is bonded to a carrier tape via laser irradiation heat fusion, a packaging method for electrical components and a packaging system for electrical components.
Description of the Related Art As in assembly field of electronic components such as semiconductor device etc., devices are normally developed and manufactured by a manufacturer, and then transferred to another manufacturer or user for further processing. For example, after semiconductor chips are manufactured in a factory or "superclean room", the chips are packaged and transferred to another manufacturer or user, such as a computer manufacturer, where the chips are mounted on devices such as a printed circuit board etc. The devices can be a transistor, a connector, a DIPS, a capacitor, a gate array, a memory chip, a stopper etc. Especially, in recent years, chip type electronic components such as IC chips or capacitors are normally provided in the form of being packaged in a carrier tape which is provided with pockets for receiving the devices. The devices are received in the pockets, and a cover tape seals the corresponding pockets. The carrier tape and cover tape are rolled to be transmitted to an end user. During usage, the cover tape is stripped off the carrier tape, and the devices are taken out to be mounted on a circuit substrate.
In this application, the cover tape has to be easily peeled off from the carrier tape, and the peeling force should be substantially stable. If the stripping force (being called as stripping strength or thermal seal strength) is too low, the cover tape is easily detached. If the stripping force is too strong or fluctuating range of the stripping force is too broad, stripping operation can not be stably done when the cover tape is stripped off by an installing machine. The cover tape normally includes heat activated type and pressure
sensitive type, in which the base surface of the cover tape is coated with heat activated adhesive (HAA) and pressure sensitive adhesive (PSA). The heat activated adhesive are bonded by a heating press head and the required stripping strength can be obtained by adjusting thermal sealing parameters such as thermal sealing temperature, dwell time, pressure etc. The heat activated type cover tape has a relatively low price, however, a special applicator device is needed with complex parameter adjustments, in addition, the stripping force is sensitive to the temperature and humidity which fluctuates in a large range, about 20-30 g. On the other hand, the applicator device required by the pressure sensitive cover tape is relatively simple without heating or pressure maintaining, and the stripping force is stable with fluctuating range of 10-15 g. However, the pressure sensitive type cover tape is expensive with few applications.
The above two types of cover tapes need precise and complex adhesive layer coating process. In addition, special formulated adhesive is needed to obtain the required stripping strength, thus increasing the cost of the whole cover tape. Meanwhile, the use of adhesive has the problem of residual glue being attached to the cover tape and the carrier tape. Therefore, there is a need for bonding the cover tape and the carrier tape without the adhesive and with stable stripping force. In addition, there is still a need for reducing the cost of the cover tape and simplifying the package of the devices.
For this purpose, many inventions have been invented for solving the above problem. U.S. Patent No. 5,234,104 discloses an assembly of mechanically interlocked cover tape and carrier tape via groove shaped structure, in which the sides of the cover tape are curved into a groove shaped structure, and the underlying carrier tape is fixed by clipping in the groove at the side edges of the cover tape. However, this type of cover tape can not be repeatedly used. U.S. Patent No. 5,499,717 discloses an assembly of a cover tape and a carrier tape which does not use adhesive, in which the cover tape is shaped into a specific outer shape, and the shape thereof sticks to the inner wall of the component pocket on the carrier tape, and the cover tape has some elastic bumping structure, so that the inner walls of the cover tape and the carrier tape can be closely stuck with each other and thereby avoiding adhesive.
The solution described above using the mechanical interlock has some limitations, since the outer shape of the cover tape is special which has poor adaptability. Due to this,
Eberts Electronics, Ltd. Singapore developed an ultrasonic bonding device, which bonds the cover tape and the carrier tape via ultrasonic. The ultrasonic bonding device is easy to use with a bonding force in a small range. However, the ultrasonic bonding still has some limitations, such as high vibration stress and poor environmental noise. Therefore, the conventional cover tape is bonded via the adhesive layer and the underlying carrier tape. The above non-adhesive bonding carrier tape/cover tape systems are also poor in versatility, with high mechanical stress and large noise etc. There are also disclosed a cover tape having two parallel score lines with some tearing guide nicks. During stripping, the cover tape is torn along the score lines thus achieving stable stripping strength. The carrier tape in the cover tape still needs heat activated glue or pressure sensitive glue to be bonded to the cover tape. However, the stripping strength is the stripping strength of the medial layer in the cover tape which has no relationship with the sticking force of the adhesive layer.
Summary
Therefore, the present inventors have determined that there is a need for a versatile, non-adhesive assembly of carrier tape and cover tape with stable stripping force in the art. To overcome one or more of the shortcomings in prior art, the present invention provides a packaging device for electronic components, in which a transparent or translucent film shaped cover tape can be bonded to a carrier tape by laser irradiation heat fusion, so that non-contact type package between the cover tape and the carrier tape can be achieved.
According to one embodiment of the invention, a packaging method and a packaging system are provided. Thus, flash or scrap will not be created during packaging, in addition, vibration or other mechanical stress will not be brought either, and heat damage or heat deformation is minimized to obtain strong bonding between the cover tape and the carrier tape.
The above objects, effects and advantages of the invention will be achieved by providing a packaging device for electronic components, comprising: a carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; and a cover tape covering the carrier tape. The cover tape is
bonded along two outer bonding portions to the edge surfaces of the carrier tape by laser irradiation heat fusion, so that a laser irradiated heat fusion area is formed to package the electronic components placed in the pockets.
According to another embodiment of the invention, a packing method for electronic components, comprising: a carrier tape transporting step, the carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; a receiving step, placing a plurality of electronic components in the pockets respectively; a covering step, covering the carrier tape with the pockets being provided with the electronic components by a cover tape; and a sealing step, bonding both sides of the cover tape to the pair of edge surfaces of the carrier tape by laser irradiation heat fusion, so that a laser heat sealing area is formed to package the electronic components placed in the pockets.
According to a further embodiment of the invention, a packaging system for electronic components is provided, comprising: a first winding roller wound with carrier tape, the carrier tape having a pair of longitudinally arranged edge surfaces in parallel, at least one row of pockets spaced apart being provided between the edge surfaces to receive the electronic components in the pockets; a loading device provided at a downstream of the first winding roller, for loading electronic components in the pockets of the carrier tape unwound from the first winding roller; a second winding roller provided at a downstream side of the loading device, and a cover tape being wound thereon; an applicator block provided at a downstream side of the second winding roller, for securing the cover tape unwound from the second winding roller on the carrier tape with the pockets being provided with the electronic components; and a laser generating device provided at a downstream of the applicator block, laser beam emitted from the laser generating device irradiating on the both edge surfaces of the carrier tape to seal the cover tape on the both edge surfaces of the carrier tape, thus the electronic components placed in the pockets being packaged.
Brief Description of the Drawings
Further disclosure, objects, advantages and aspects of the present invention may be better understood by those skilled in the relevant art by reference to the following
description of embodiments taken in conjunction with the accompanying drawings, which are given by way of illustration only, and thus are not limitative of the present invention, and in which:
Fig. 1 is a perspective view of a packaging device for electronic components according to an embodiment of the invention with a middle part of the cover tape being removed, exposing the electronic components placed in pockets;
Fig. 2 is a longitudinal cross sectional view of the cover tape as shown in Fig. 1; Fig. 3 is a schematic state view, with the cover tape being cross-sectioned longitudinally, in which the edge surfaces of the cover tape and the carrier tape in the packaging device as shown in Fig.1 are bonded by laser irradiation heat fusion;
Fig. 4 is a perspective view of a packaging device for electronic components according to another embodiment of the invention; and
Fig. 5 is a perspective view of a packaging system for electronic components according to an embodiment of the invention.
Detailed Description
Above and other aspects of features of the present invention will be become readily apparent with preferred embodiment and referenced to accompany drawing by a detail description hereinafter, wherein the like reference numerals refer to the like elements throughout the specification.
Referring to Fig. 1, according to an exemplary embodiment of the invention, a packaging device for electronic components is provided for packaging electronic components, comprising: a carrier tape 10 having a pair of longitudinally arranged edge surfaces 11, 12 in parallel, one, two or more spaced apart rows of pockets 13 being provided between the edge surfaces 11, 12 to receive the electronic components 30 in the pockets 13; and a cover tape 20 covering the carrier tape 10. In an exemplary embodiment of the present invention, the pocket 13 comprises four side walls 14 and a bottom wall (not shown) joined to lower parts of the four side walls. Two opposing walls of the four side walls 14 are formed so as to extend downward from inner sides of the edge surfaces 11, 12, and the remaining two other side walls are formed as two adjoining partition walls of the pocket 13. It should be noted the shape of the pockets can be configured according to
the shape of the electronic components to be contained therein, such as rectangular shape, cube, cylinder, frustum, flat shape, etc.
In an embodiment of the invention, a plurality of guiding holes 15 are provided in even distance on at least one of the edge surfaces 11, 12. The guiding holes 15 are configured to be engaged with teeth (not shown) formed on a first winding roller 41 (c.f.
Fig. 5) when the carrier tape 10 is wound around the first winding roller 41, so that the carrier tape 10 is guided to be wound onto the first winding roller 41 or unwound from the first winding roller 41.
According to an exemplary embodiment of the invention, the cover tape 20 is a transparent conductive or static dissipative film with light haze as shown in Fig. 2. As the bonding material for laser irradiation bonding, almost all thermoplastics and thermoplastic elastomer can be used, such as PP (polypropylene), PS (polystyrene), PC (polycarbonate), ASS (acrylonitrile-butadiene-styrene), PA (polyamide), PMMA (polymethyl methacrylate), PET (polyethylene terephthalate) and PBT (polybutylene terephthalate) etc. Therefore, the base film 25 used as the main body of the cover tape 20 can be transparent polymer film, including but not limited to polypropylene, polyethylene, polycarbonate, celluloid, nylon, polyester etc.
There is no specific limitation on the thickness of the base film 25, however, preferably, being transparent. In an exemplary embodiment of the invention, the base film 25 can be a biaxially oriented polypropylene (BOPP) film with a thickness of 50 μm. The cover tape 20 may further comprise a conductive layer 26 or an anti-electrostatic coating layer 27 provided on at least a side of the base film 25. Alternatively, as shown in Figs. 2 and 3, the conductive layer 26 can be formed on a side and the anti-electrostatic coating layer 27 is formed on the other side. A protecting layer 28 or other functional coating layer can be coated on a side of the base film 25 facing the electronic components 30. In an embodiment of the invention, the protecting layer 28 contains a polyurethane coating layer to suppress reduction of surface conduction, so that the electronic components 30 can be protected from static electricity or abrasion during packaging or delivering thereof. The protecting layer can be coated on the conductive layer 26 or the anti-electrostatic coating layer 27. In an embodiment of the invention, the conductive layer 26 can be a metal layer which can be formed on the base film by sublimation coating or magnetic sputtering.
The material for the carrier tape 10 includes, but not limited to, polypropylene, polycarbonate, polyester, polystyrene etc. The carrier tape 10 can be transparent, including non-conductive or sputtering anti-electrostatic agent, and it can also include conductive carbon black. In an exemplary embodiment of the invention, the carrier tape 10 is conductive, which has excellent static dissipation for all packaged electronic components, avoiding static damage to the electronic components when the cover tape 20 is bonded to the carrier tape 10 or stripped off the carrier tape 10. The conductive carrier tape 10 is formed as black due to the incorporated carbon black. Therefore, during laser bonding, the bonding region of the carrier tape 10 for containing the electronic components absorbs energy, and the transparent cover tape 20 for covering the edge surfaces 11, 12 of the carrier tape 10 is melted, forming laser irradiation heat fusion area 23 as shown in Fig. 4, thus, the cover tape 20 is bonded to the edge surfaces 11, 12, and the electronic components 30 contained in the pockets 11 are packaged. Alternatively, if the cover tape 20 is packaged on the transparent carrier tape 10, infrared absorb coating material is required to be coated at a contacting place between the cover tape 20 and the carrier tape 10 to achieve the bonding between the two transparent materials. The coating material generates heat under the radiation of the laser, and the material of the neighboring carrier tape 10 and the cover tape 20 is melted thus achieving the bonding therebetween.
Referring to Fig. 1 again, two longitudinal score lines 21 are provided on the cover tape 20 at inner sides of the laser radiation heat fusion area. The two score lines 21 are typically continuous, extending in a direction parallel to a longitudinal direction of the cover tape 20. The score lines 21 are formed by slitting the surface of the cover tape 20 by mechanical slitting or laser etc. The interval between the two score lines 21 is generally larger than lateral dimensions of the electronic components 30 in the pockets 11. And the interval can be varied in the range of about 4 mm to about 254 mm according to the varied widths of the carrier tape.
In a further exemplary embodiment of the invention, referring to fig. 4, tearing guide nicks 22 in periodic intervals extending longitudinally from the score lines 21 are provided on the cover tape 20 at the outer sides of the two score lines 21. The inner sides of the guiding nicks 22 contacts with the outer sides of the score lines 21 but preferably does not go beyond the position of the score lines. In an exemplary embodiment of the invention, the guiding nicks 22 forms an angle of about 45 degrees with respect to the
score lines 21 with the length of 0.66 mm. When the cover tape 20 is stripped off the carrier tape 10, the cover tape 20 will follow the tearing guide nicks 22 into the positions of the score lines and torn along the score lines 21, at which time, the stripping strength has no relationship with the bonding strength of the laser. Then, the medial portion of the cover tape 20 is stripped away from the outside portion thereof along the score lines. It should be noted, when the cover tape 20 is stripped away along the score lines 21 , it is preferable to have stable tearing strength to obtain uniform stripping strength. Therefore, the depth of the guiding nicks 22 is preferably carefully controlled, and the depth thereof on the continuous cover tape 20 is preferably less than 0.0254 mm. If the electronic components are taken out from the carrier tape 10, when the cover tape 20 is stripped off the carrier tape 10 already packaged, the fusion area 23 outside the cover tape 20 will remain on the carrier tape 10 and keep in stick with the carrier tape 10, whereas the medial portion 24 of the cover tape 20 is stripped off along the score lines 21, and the electronic components 30 in the pockets 13 is exposed thereunder. When the medial portion 24 of the cover tape 20 is stripped off, the stripped carrier tape 20 is wound, being discarded or recycled.
The packaging system for electronic components according to an embodiment of the invention will be described with reference to Fig. 5. In an exemplary embodiment of the invention, the packaging system for electronic components comprises: a first winding roller 41 wound with carrier tape 10 as described above for receiving electronic components; a loading device 42 provided at a downstream of the first winding roller 41, for loading electronic components 30 in the pockets 13 of the carrier tape 10 unwound from the first winding roller 41; a second winding roller 43 provided at a downstream side of the loading device 42, and the cover tape 20 being wound thereon; an applicator block 44 provided at a downstream side of the second winding roller 43 and above the transferring path of the cover tape 20, for covering the cover tape 20 unwound from the second winding roller 43 onto the carrier tape 10 with the electronic components 30 provided in the pockets 13; and a laser emitter 45 provided at a downstream of the applicator block 44, laser beam 48 emitted from the laser emitter 45 irradiating on the edge surfaces of the carrier tape 10 from the upper portion of the carrier tape 10, so that the cover tape 20 is thermally fused to both edge surfaces under the irradiation of the laser beam 48, thus packaging the electronic components 30 in the pockets 13.
In a further embodiment of the invention, the packaging system for electronic components of the invention further comprises a third winding roller 46 for winding the packaged carrier tape 10 and the cover tape 20. It can be understood that rotating speeds of the first, second and third winding rollers 41, 43 and 46 can be controlled simultaneously by a common control mechanism so that the movements of the carrier tape 10 and the cover tape 20 can be synchronized. The first and third winding roller 41 , 46 are typically formed with teeth (not shown) at even intervals at both sides of the outer circumferential surfaces thereof to be engaged with a plurality of holes 15 (referring to Figs. 1 and 4) formed in the edge surfaces 11, 12 of the carrier tape 10, to assist the winding and/or unwinding of the carrier tape 10 to/from the first and third winding rollers 41, 46. The packaging system for electronic components according to an embodiment of the invention further comprises a platform 47 under the applicator block 44 for supporting the carrier tape 10 when the carrier tape 10 is covered by the cover tape 20 via the applicator block 44. In an embodiment of the invention, the loading device 42 is a suction nozzle for detachably suctioning the packaged electronic components 30, then the suction nozzle moves onto a position above the pocket 13 where the carrier tape 10 is unwound and releases the suctioned electronic component, so that the electronic components 30 are provided in the pockets 13. Alternatively, the loading device 42 can also be a mechanical hand for gripping and releasing electronic component. In an embodiment of the invention, the laser emitter 45 can be Nd: YAG or semiconductor diode. The wavelength of the laser emitted from the Nd: YAG type laser emitter is 1064 nm, which can be absorbed easily by specific filling material or pigment. And the laser beam can be easily transferred to laser head via light-guide fiber, especially in welding art of automatic device. The laser wavelength generated by the diode laser emitter ranges from 800 to 1000 nm, which is the most efficient energy range for welding.
And the diode laser emitter structure is compact which can be conveniently installed to automatic device via fiber transmission. The absorbing feature is similar to that of the Nd:YAG laser emitter.
Thermal fusion of plastics sometimes uses CO 2 laser, which can generate light wave having a wavelength of about 10 micron (μm) that can be more easily absorbed by plastics compared with laser generated by Nd:YAG and diode laser emitters. However, the penetrating property of the laser generated by the CO 2 laser is less strong than the lasers
generated by the other two kinds of laser emitters. Therefore, The CO 2 laser emitter is mainly used for film material welding. However, the CO 2 laser emitter can not be transmitted via fiber. And rigid transmit light path can only be constructed by an optical system composed of lens-reflective mirrors. In addition, the operability of the laser head is inferior to that of the semiconductor laser emitter.
The laser beam 48 generated by the laser emitter 45 irradiates on the cover tape 20 and the carrier tape 10 via light guide fiber or lens system. More specifically, the laser beam 48 irradiates onto the two edge surfaces 11, 12 of the carrier tape 10. The minimum radius of the focus point irradiated by the laser beam 48 can be adjusted within the range of 0.1-0.5mm. Preferably, the diameter range of thereof falls within the range of 0.4 - 0.5 mm. The bonding area at both sides of the pocket 13 can be adjusted according to the widths of the pockets 13.
According to an aspect of the invention, a packing method for electronic components as shown in Fig. 5 is provided, comprising: a carrier tape transporting step, i.e., driving the first winding roller 41 to rotate so as to unwind the carrier tape 10 wound on the first winding roller 41 so that the carrier tape 10 is transmitted along the guiding device provided on the platform 47; a loading step, i.e., placing the plurality of electronic components 30 into the pockets 13 in the carrier tape 10 by the loading device 42 such as the suction nozzles or the mechanical hand; a covering step, i.e., covering the cover tape 20 on the carrier tape 10 with the electronic components 30 being provided in the pockets 10 by the special applicator block 44; and a bonding step, i.e., irradiating both sides of the cover tape 20 by the laser beam 48 generated from the laser emitter 45, so that the both sides of the cover tape 20 are thermally bonded to both edge surfaces 11, 12 of the carrier tape 10 to seal the electronic components 30 placed in the pockets 13. The laser packaging strength can be achieved by adjusting the power, etc., of the laser emitter 45, however, the laser bonding strength should be larger than the tearing strength of the cover tape 20 along the score lines 21 when tearing.
The laser packaging process using the laser emitter 45 can be continuous or periodic, the packaged carrier tape 10 and the cover tape 20 are wound onto the third winding roller 46, which is finally sent to a downstream user.
Further, longitudinal score lines 21 can be formed on the inner surfaces of the cover tape 20 at the inner sides of the laser irradiation heat fusion area by a mechanical
slitting or laser irradiation, and the tearing guide nicks 22 extending longitudinally from the score lines in periodic intervals outside the score lines can be formed in a similar way. As described above, the system of the carrier tape and cover tape by laser bonding has many advantages. Firstly, the laser bonding has a rapid speed, without mechanical stress or residual glue, and it also has high bonding precision. There are score lines on the cover tape according to the invention. The cover tape will be stripped off along the score lines during stripping without depending on the strength of the bonding layer, thus the stripping force is stable. Especially, since the cover tape is bonded by laser, the conventional heat activated adhesive or pressure sensitive adhesive is avoided, thus, reducing the cost of the cover tape. In addition, the cover tape structure is simple, complex glue coating process can be avoided.
According to the packaging device for electronic components, packaging system and packaging method thereof, the heat generated by the laser beam emitted from the laser emitter melts the contacting surface of the cover tape 20 made of plastics being irradiated, which further thermally bonds the thermoplastic cover tape 20 and the carrier tape 10. The laser irradiation heat fusion has a rapid speed which is adapted to continuous production. Further, since the laser emitter for bonding does not contact the cover tape 20 and the carrier tape 10, a non-contact type sealing is achieved. During sealing, no adhesive is applied, thus no flash or residual is created, maintaining the environment clean. And the sealing strength can be controlled by adjusting the strength of the laser beam. Therefore, this packaging method for electronic components according to the invention has high speed with high efficiency and automation, and the packaging precision is high which is adapted to package electronic components with different shapes. And the laser irradiation heat fusion technology according to the invention will not generate vibration or other mechanical stress, and it makes thermal damage or thermal deformation minimized, thus achieving firm bonding. While the embodiments of the present invention have been described by way of examples taken in conjunction with the accompanying drawings, it should be appreciated that modifications, additions and variations to and from the above described embodiments may be made without deviating from the scope of the present invention which is defined by the accompanying claims.