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Title:
PACKAGING FILM AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2020/050416
Kind Code:
A1
Abstract:
Provided is a packaging film capable of improving releasability of flour paste. This packaging film comprises, in order, a substrate layer and a seal layer, where the seal layer has a contact layer that contacts contents and the contact layer contains a thermoplastic resin, an antistatic, and a lubricant.

Inventors:
HAYASHI KENTARO (JP)
Application Number:
PCT/JP2019/035267
Publication Date:
March 12, 2020
Filing Date:
September 06, 2019
Export Citation:
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Assignee:
KYORAKU CO LTD (JP)
International Classes:
B65D65/40; B32B27/00; B32B27/18; B65D30/02
Domestic Patent References:
WO2012144536A12012-10-26
Foreign References:
JP2005305830A2005-11-04
JP2016117515A2016-06-30
JP2017013479A2017-01-19
JP2001048229A2001-02-20
JP2015044935A2015-03-12
US20150118423A12015-04-30
JP2019014516A2019-01-31
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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