Title:
PACKAGING IMPLEMENT, PACKAGE, AND PACKAGING METHOD USING PACKAGING IMPLEMENT
Document Type and Number:
WIPO Patent Application WO/2017/022078
Kind Code:
A1
Abstract:
Provided is a packaging implement having a simple structure and capable of packaging an article easily. The packaging implement 1 has a structure in which a tubular film 30 is wrapped around a board 10. The board 10 is subdivided via a main folding line 21 and comprises a loading surface 11 and an adjoining surface 13 that adjoins the loading surface 11. To package an article, the adjoining surface 13 is bent with respect to the loading surface 11 and, with the board 10 in a bent state, the article is placed in the space between the loading surface 11 and the film 30. With the article disposed in the space, the adjoining surface 13 is unfolded with respect to the loading surface 11 to stretch the film 30 while in contact with the article and to press the article onto the board 10.
Inventors:
KANEMARU MASAAKI (JP)
Application Number:
PCT/JP2015/072082
Publication Date:
February 09, 2017
Filing Date:
August 04, 2015
Export Citation:
Assignee:
TAIYO SHIGYO CO LTD (JP)
TOMOKU CO LTD (JP)
TOMOKU CO LTD (JP)
International Classes:
B65D73/00
Domestic Patent References:
| WO2008126199A1 | 2008-10-23 |
Foreign References:
| JPH09501128A | 1997-02-04 |
Attorney, Agent or Firm:
TSUBAKI, Yutaka (JP)
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