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Patent Searching and Data


Title:
PACKAGING IMPLEMENT, PACKAGE, AND PACKAGING METHOD USING PACKAGING IMPLEMENT
Document Type and Number:
WIPO Patent Application WO/2017/175316
Kind Code:
A1
Abstract:
Provided is a packaging implement having a simple structure and capable of packaging an article easily. The packaging implement (501) has a structure in which a tubular film (530) is wrapped around a board (510). The board (510) is subdivided via a main folding line (21) and has an arrangement surface (511) and an adjoining surface (512). The film (530) is wrapped around the board (510) such that the main folding line (21) runs through the inside of the tube formed by the film (530). The arrangement surface (511) and/or the adjoining surface (512) is provided with a relaxation structure whereby tension on the film (530) can be partially weakened when the film (530) is tightened in a state of contact with an article. To package an article, the article is placed in a gap between the arrangement surface (511) and the film (530) with the board (10) in a folded state. The board (510) is unfolded in the state in which the article is arranged in the gap.

Inventors:
KAWATA KUMIKO (JP)
IHARA FUMIYOSI (JP)
Application Number:
PCT/JP2016/061177
Publication Date:
October 12, 2017
Filing Date:
April 05, 2016
Export Citation:
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Assignee:
TAIYO SHIGYO CO LTD (JP)
TAIYO CO LTD (JP)
International Classes:
B65D73/00; B65B5/04; B65D77/26
Domestic Patent References:
WO2008126199A12008-10-23
Foreign References:
US5676245A1997-10-14
US5678695A1997-10-21
JPH09501128A1997-02-04
JP2004001893A2004-01-08
JP2006248549A2006-09-21
Attorney, Agent or Firm:
TSUBAKI, Yutaka (JP)
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