Title:
PACKAGING LAMINATE AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2023/181852
Kind Code:
A1
Abstract:
This laminate is provided with at least a base material layer, an intermediate layer, and a sealant layer. All the base material layer, the intermediate layer, and the sealant layer contain polypropylene. 90 mass% or more of the whole laminate is made of polypropylene. A thermal shrinkage of the laminate calculated by the following equations (1) and (2) after heated in an oven for 15 minutes at 150℃ is 12.0% or less in both an MD direction and a TD direction. (1) Thermal shrinkage in the MD direction (%) = (a length in the MD direction before heating – a length in the MD direction after heating)/a length in the MD direction before heating × 100
(2) Thermal shrinkage in the TD direction (%) = (a length in the TD direction before heating – a length in the TD direction after heating)/a length in the TD direction before heating × 100
Inventors:
OGIHARA YU (JP)
Application Number:
PCT/JP2023/008077
Publication Date:
September 28, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/32; B32B27/00; B65D65/40
Domestic Patent References:
| WO2019065306A1 | 2019-04-04 |
Foreign References:
| JP2021020391A | 2021-02-18 | |||
| JPH09290477A | 1997-11-11 | |||
| JP2021178974A | 2021-11-18 | |||
| JP2018089567A | 2018-06-14 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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