Title:
PACKAGING LAMINATE AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2023/238825
Kind Code:
A1
Abstract:
Provided is a packaging laminate 100A composed of at least 90 mass% polypropylene, said packaging laminate 100A comprising at least a substrate layer 11 that includes a first polypropylene film and a sealant layer 12 that includes a second polypropylene film, wherein: the first polypropylene film is a oriented polypropylene film; the first polypropylene film and the second polypropylene film are positioned such that the respective MDs thereof substantially match; the thermal shrinkage RMD1 in the MD of the first polypropylene film is not more than 10%; the thermal shrinkage RTD1 in the TD of the first polypropylene film is not more than 12%; and the thermal shrinkage RTD2 in the TD of the second polypropylene film is less than the thermal shrinkage RTD1 but not less than 0.5%.
Inventors:
ONO YASUNORI (JP)
OGIHARA YU (JP)
OGIHARA YU (JP)
Application Number:
PCT/JP2023/020833
Publication Date:
December 14, 2023
Filing Date:
June 05, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
B65D65/40; B32B7/028; B32B9/00; B32B27/32
Domestic Patent References:
| WO2019065306A1 | 2019-04-04 |
Foreign References:
| JP2021020391A | 2021-02-18 | |||
| JP2021178974A | 2021-11-18 | |||
| JP2018089567A | 2018-06-14 | |||
| JPH09290477A | 1997-11-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: SPOON TAPPING DEVICE, AND AUTOMATIC WEIGHING DEVICE
Next Patent: MICROWAVE PLASMA CVD DEVICE
Next Patent: MICROWAVE PLASMA CVD DEVICE