Title:
PACKAGING MATERIAL FILM AND PACKAGING MATERIAL, PACKAGING BAG, AND PACKAGING COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/118668
Kind Code:
A9
Abstract:
A packaging material film according to the present disclosure comprises a first resin layer that includes a polyolefin resin and a porous filler. The ratio Y/X of the average particle size Y μm of the porous filler to the thickness X μm of the first resin layer is 0.02-3.5, and the content percentage of the porous filler in the first resin layer is 0.5-30 mass%. Additionally, the packaging material according to the present disclosure comprises a base material and a packaging material film provided on the base material. In the packaging material, the packaging material film comprises the abovementioned packaging material film, and the packaging material film first resin layer surface that is on the reverse side from the base material is exposed.
Inventors:
TANAKA RYO (JP)
NAGAI AKI (JP)
WAKABAYASHI HIROYUKI (JP)
NAGAI AKI (JP)
WAKABAYASHI HIROYUKI (JP)
Application Number:
PCT/JP2021/042473
Publication Date:
October 12, 2023
Filing Date:
November 18, 2021
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/00; B32B27/20; B32B27/32; B65D65/40; B65D75/26
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: