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Patent Searching and Data


Title:
PACKAGING MATERIAL AND PREPARING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/226698
Kind Code:
A1
Abstract:
The present invention relates to a printed substrate comprising a first paper layer, the first paper layer comprising a first side and an opposing second side, the first side comprising a flexography print area and a non-print area, wherein the flexography print area has a color density no less than about 0.70 as measured according to Color Density Test disclosed herein, and wherein the non-print area has a roughness in the range of from about 3μm to about 15μm as measured according to Surface Roughness Test disclosed herein; a package for accommodating one or more articles comprising the printed substrate; and a method of making the printed substrate.

Inventors:
CHENG ENJUN (CN)
KOHLWEYER CHRISTIAN (DE)
Application Number:
PCT/CN2021/089685
Publication Date:
November 03, 2022
Filing Date:
April 25, 2021
Export Citation:
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Assignee:
PROCTER & GAMBLE (US)
CHENG ENJUN (CN)
KOHLWEYER CHRISTIAN (DE)
International Classes:
D21H27/10; B41M1/04; B41M5/52; D21H19/74
Domestic Patent References:
WO2002014080A22002-02-21
Foreign References:
US3952119A1976-04-20
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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