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Patent Searching and Data


Title:
PACKAGING MATERIAL WITH SHOCK ABSORBING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/176781
Kind Code:
A1
Abstract:
A packaging material (10) with a shock absorbing structure is provided with biodegradable interior and exterior sheets integrated in a state in which constituting members are partially connected to and overlapped with each other. A packaging box (11) for packaging an object to be packaged is formed of the interior sheet. A connecting part partially connected to at least one surface of the packaging box (11) and a shock absorbing part (12) in which a part connected to the connecting part is configured to be foldable are formed of the exterior sheet.

Inventors:
HATTORI YUMA (JP)
Application Number:
PCT/JP2022/005455
Publication Date:
August 25, 2022
Filing Date:
February 10, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B65D81/05
Foreign References:
JPS59175008U1984-11-22
JPS58167021U1983-11-07
JP2013249119A2013-12-12
JP2007062755A2007-03-15
CN104085588A2014-10-08
JP2015231858A2015-12-24
JP2013107675A2013-06-06
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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