PACKAGING METHOD AND PACKAGING APPARATUS

Title:

PACKAGING METHOD AND PACKAGING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2021/250810

Kind Code:

A1

Abstract:

The purpose of the present invention is to stabilize the shape of a stepped recess and to prevent damage from occurring in a deep portion of the stepped recess.　In the present invention, a packaging apparatus comprises: a molding device for molding a recess in a film and molding a protrusion at the bottom of the recess; a protrusion/recess inversion device for deforming the protrusion into a second recess that recedes below the bottom of the recess; and a sealing device for sealing a lid member onto the film so that the lid member covers the recess, in which an article is accommodated.

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Inventors:

SATO MASATSUNE (JP)

Application Number:

PCT/JP2020/022823

Publication Date:

December 16, 2021

Filing Date:

June 10, 2020

Export Citation:

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Assignee:

OMORI MACHINERY (JP)

International Classes:

B65B9/04

Foreign References:

JP2002145215A	2002-05-22
JPH06143399A	1994-05-24
JP2005111751A	2005-04-28

Attorney, Agent or Firm:

ISSHIKI & CO. (JP)

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