Title:
PACKAGING METHOD AND PACKAGE BODY
Document Type and Number:
WIPO Patent Application WO/2024/012033
Kind Code:
A1
Abstract:
Disclosed in the present application are a packaging method and a package body. The packaging method comprises: acquiring a carrier, and processing first bonding pads on a side surface of the carrier; processing second bonding pads on the side surfaces of the first bonding pads away from the carrier; acquiring a first plastic packaging material, and press-fitting the first plastic packaging material with the second bonding pads, the first bonding pads and the side surface of the carrier provided with the first bonding pads, so as to form a first plastic package body; processing a chip bonding pad on the side surface of each first bonding pad away from each second bonding pad; mounting a chip on at least one chip bonding pad; and acquiring a second plastic packaging material, and press-fitting the second plastic packaging material with the chip, the side surface of the chip bonding pad away from each second bonding pad and the side surface of the first plastic package body close to each first bonding pad, so as to form a second plastic package body. In the present application, by means of processing the second bonding pads on side surfaces of the first bonding pads before the chip is mounted, the risk of position offset occurring between the first bonding pads and the second bonding pads can be reduced.
Inventors:
LI YUHONG (CN)
XIAO HAOYANG (CN)
GAO CHENSHAN (CN)
SONG GUANQIANG (CN)
JIANG JING (CN)
XIAO HAOYANG (CN)
GAO CHENSHAN (CN)
SONG GUANQIANG (CN)
JIANG JING (CN)
Application Number:
PCT/CN2023/093328
Publication Date:
January 18, 2024
Filing Date:
May 10, 2023
Export Citation:
Assignee:
SKY CHIP INTERCONNECTION TECH CO LTD (CN)
International Classes:
H01L21/48; H01L21/50; H01L21/56; H01L21/60; H01L23/31; H01L23/498
Foreign References:
| CN115312393A | 2022-11-08 | |||
| CN104779220A | 2015-07-15 | |||
| CN103887281A | 2014-06-25 | |||
| CN101106118A | 2008-01-16 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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