Title:
PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP
Document Type and Number:
WIPO Patent Application WO/2017/059781
Kind Code:
A1
Abstract:
Provided are a packaging method and package structure for an image sensing chip. The method comprises: providing a wafer (100) having a first surface (101) and a second surface (102) opposite to the first surface (101), wherein the wafer (100) has multiple imaging sensing chips (110) arranged as a grid, the image sensing chip (110) has an image sensing region (111) and a solder pad (112), and the image sensing region (111) and the solder pad (112) are located at the side of the first surface (101) of the wafer (100); forming, at the second surface (102) of the wafer (100), an opening (113) extending towards the first surface (101), wherein the opening (113) exposes the solder pad (112); forming, at the second surface (102) of the wafer (100), a V-shaped cut recess (103) extending towards the first surface (101); and coating a photosensitive ink (117) on the second surface (102) of the wafer (100), such that the photosensitive ink (117) fills the V-shaped cut recess (103) and covers the opening (113), and a cavity (119) is formed between the opening (113) and the photosensitive ink (117). By forming the cavity (119) between the opening (113) and the photosensitive ink (117), the present invention effectively prevents separation of a wiring layer (115) from the solder pad (112), thereby improving the package yield rate of image sensing chips, and enhancing the reliability of the image sensing chip package structure.
Inventors:
WANG ZHIQI (CN)
WANG ZHUOWEI (CN)
XIE GUOLIANG (CN)
WANG ZHUOWEI (CN)
XIE GUOLIANG (CN)
Application Number:
PCT/CN2016/100817
Publication Date:
April 13, 2017
Filing Date:
September 29, 2016
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L21/60; H01L23/488
Foreign References:
| CN105244339A | 2016-01-13 | |||
| CN205050828U | 2016-02-24 | |||
| CN101419952A | 2009-04-29 | |||
| CN101800207A | 2010-08-11 | |||
| US20090284628A1 | 2009-11-19 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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