Title:
PACKAGING PAPERBOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/216686
Kind Code:
A1
Abstract:
This packaging paperboard is configured to electrically connect RFIC elements and antenna patterns by: printing a plurality of antenna patterns at predetermined intervals on one side layer of a packaging paperboard which is provided with at least two layers; attaching a plurality of RFIC elements at predetermined intervals on the other side layer; and bonding two layers together so as to allow the RFIC elements and the antenna patterns to be sandwiched between the layers.
Inventors:
KATO NOBORU (JP)
MIURA TEPPEI (JP)
MIURA TEPPEI (JP)
Application Number:
PCT/JP2018/019643
Publication Date:
November 29, 2018
Filing Date:
May 22, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/077; B65D25/20; H01Q1/38; H01Q11/00
Foreign References:
| JP2005326919A | 2005-11-24 | |||
| JP2004318571A | 2004-11-11 | |||
| JP2013145450A | 2013-07-25 | |||
| JP2002352206A | 2002-12-06 | |||
| JP2008160874A | 2008-07-10 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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