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Title:
PACKAGING PAPERBOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/216686
Kind Code:
A1
Abstract:
This packaging paperboard is configured to electrically connect RFIC elements and antenna patterns by: printing a plurality of antenna patterns at predetermined intervals on one side layer of a packaging paperboard which is provided with at least two layers; attaching a plurality of RFIC elements at predetermined intervals on the other side layer; and bonding two layers together so as to allow the RFIC elements and the antenna patterns to be sandwiched between the layers.

Inventors:
KATO, Noboru (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
MIURA, Teppei (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2018/019643
Publication Date:
November 29, 2018
Filing Date:
May 22, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
G06K19/077; B65D25/20; H01Q1/38; H01Q11/00
Foreign References:
JP2005326919A2005-11-24
JP2004318571A2004-11-11
JP2013145450A2013-07-25
JP2002352206A2002-12-06
JP2008160874A2008-07-10
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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