Title:
PACKAGING STRUCTURE OF BALL GRID ARRAY OF PACKAGING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/007067
Kind Code:
A1
Abstract:
A packaging structure of a ball grid array and a packaging method thereof, the packaging method comprising: providing a substrate, wherein a side surface of the substrate at least has a first region, a second region, and a third region for disposing solder balls (M1); soldering at least one first solder ball in the first region, soldering at least one second solder ball in the second region, and soldering at least one third solder ball in the third region, wherein at least one parameter of each of the first solder ball, the second solder ball, and the third solder ball is different, and the parameters comprise thermal conductivity, a thermal expansion coefficient, and a size (M2). In the packaging structure of the ball grid array and the packaging method thereof, a plurality of soldering regions are defined below a substrate, a solder ball with at least one parameter differing from the others is soldered in each soldering region, and the parameters comprise thermal conductivity and size. Hence, solder balls having different parameters can be soldered according to the specific requirements of each soldering region, so as to improve overall performance of a packaging structure of a ball grid array.
Inventors:
LIANG XINFU (CN)
WANG YAQIN (CN)
WANG YAQIN (CN)
Application Number:
PCT/CN2019/078740
Publication Date:
January 09, 2020
Filing Date:
March 19, 2019
Export Citation:
Assignee:
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD (CN)
International Classes:
H01L21/56; H01L23/12
Foreign References:
| US20140091463A1 | 2014-04-03 | |||
| CN102214627A | 2011-10-12 | |||
| CN103219310A | 2013-07-24 | |||
| CN108878302A | 2018-11-23 | |||
| CN108899283A | 2018-11-27 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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