Title:
PACKAGING STRUCTURE, PACKAGING METHOD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/090978
Kind Code:
A1
Abstract:
A packaging structure, a packaging method, and an electronic device belonging to the technical field of packaging. The packaging structure comprises a first barrier layer (51) and a buffer layer (52) arranged in a stack, the buffer layer (52) being doped with a modified epoxy resin, and the modified epoxy resin can react with the first barrier layer (51) under UV irradiation for bonding the buffer layer and the first barrier layer (51). After doping the modified epoxy resin in the buffer layer (52), the modified epoxy resin reacts with the first barrier layer (51) under UV irradiation, so that the modified epoxy resin adheres with the first barrier layer (51) so as to bond the buffer layer (52) and the first barrier layer (51), solving the technical difficulty in the prior art that an organic layer and an inorganic layer are easily peeled off.
Inventors:
GUO TIANFU (CN)
Application Number:
PCT/CN2018/073840
Publication Date:
May 16, 2019
Filing Date:
January 23, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L51/56; H01L51/52
Foreign References:
| CN107170902A | 2017-09-15 | |||
| CN101431145A | 2009-05-13 | |||
| CN106188497A | 2016-12-07 | |||
| CN103265925A | 2013-08-28 | |||
| EP0263237A2 | 1988-04-13 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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