Title:
PACKAGING STRUCTURE AND METHOD FOR LASER DIODE DIE, AND RANGING APPARATUS AND MOVABLE PLATFORM
Document Type and Number:
WIPO Patent Application WO/2023/070442
Kind Code:
A1
Abstract:
A packaging structure and method for a laser diode die, and a ranging apparatus and a movable platform. The packaging structure (300) comprises: a substrate (310), which comprises a first surface and a second surface opposite the first surface; a laser diode die (320), which comprises a light-emitting area for emitting light, and is arranged on the first surface of the substrate (310); a reflection member (370), which is arranged on the first surface of the substrate (310), is arranged adjacent to the laser diode die (320) and is used for reflecting the light emitted from the light-emitting area and then emitting same; a first package (350), which at least covers the laser diode die (320) and the reflection member (370), wherein the first package (350) is made of a transparent insulating material; and a second package (360), which is located on the first surface of the substrate (310), wherein the second package (360) abuts against at least part of an edge of the first package (350), and the second package (360) comprises a non-transparent insulating material.
Inventors:
ZHENG GUOGUANG (CN)
LUO FEIYU (CN)
WANG GUOCAI (CN)
LIU XIANG (CN)
LUO FEIYU (CN)
WANG GUOCAI (CN)
LIU XIANG (CN)
Application Number:
PCT/CN2021/127051
Publication Date:
May 04, 2023
Filing Date:
October 28, 2021
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H01S5/022; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| WO2020107164A1 | 2020-06-04 |
Foreign References:
| CN211265963U | 2020-08-14 | |||
| CN111370337A | 2020-07-03 | |||
| CN209896436U | 2020-01-03 | |||
| CN111430249A | 2020-07-17 | |||
| US5327443A | 1994-07-05 |
Attorney, Agent or Firm:
P.C. & ASSOCIATES (CN)
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