Title:
PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/206795
Kind Code:
A1
Abstract:
Provided are a packaging structure and a packaging method; the packaging method comprises: providing a chip unit (100) which has a first surface (100a), the first surface comprising a device region (102); providing a protective cover plate (200) which has a second surface (200a); forming an adhesive unit (3001) having variable viscosity, which bonds together, face-to-face, the first surface (100a) of the chip unit (100) and the second surface (200a) of the protective cover (200); processing the adhesive unit (3001) to form a first region (3001a) and a second region (3001b) which have different viscosities within the adhesive unit (3001). In the packaging method, the first region and the second region which have different viscosities are formed by means of irradiation of a light source or heating, so that the bonding force between the chip unit and the protective cover plate is reduced but not completely eliminated, and in a subsequent on-board process for the packaging structure, the protective cover plate may still protect the package structure from contamination or damage; after completion of the on-board process, the protective cover may be easily removed without affecting the performance of the chip unit.
Inventors:
WANG ZHIQI (CN)
WANG ZHUOWEI (CN)
CHEN LIJUN (CN)
WANG ZHUOWEI (CN)
CHEN LIJUN (CN)
Application Number:
PCT/CN2017/085915
Publication Date:
December 07, 2017
Filing Date:
May 25, 2017
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L27/146; H01L21/98
Foreign References:
| CN105977271A | 2016-09-28 | |||
| CN205810785U | 2016-12-14 | |||
| CN102623471A | 2012-08-01 | |||
| CN103904093A | 2014-07-02 | |||
| CN102496622A | 2012-06-13 | |||
| CN104516194A | 2015-04-15 | |||
| JP2014175343A | 2014-09-22 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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