Title:
PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/006738
Kind Code:
A1
Abstract:
Disclosed are a packaging structure and a packaging method. The packaging structure comprises: substrates (201, 202); a circuit wiring layer (203) arranged on the substrates (201, 202); a conductive bump (204) located on the circuit wiring layer (203); a semiconductor chip (205) mounted above the substrates (201, 202) in a reversed manner, wherein a function area (206) and discrete bonding pads (207) around the function area (206) are provided on a first surface, facing towards the substrates (201, 202), of the semiconductor chip (205), and the bonding pads (207) are electrically connected to the conductive bump (204); a sealing layer (210) located on the substrates (201, 202), the sealing layer (210) surrounding the semiconductor chip (205); and a blocking structure (208) located on the substrates (201, 202), the blocking structure (208) surrounding the function area (206) so as to stop materials of the sealing layer (210) overflowing into the function area (206), thereby preventing the function area from being contaminated, and improving the performance and the yield of the packaging structure.
Inventors:
WANG ZHIQI (CN)
SHEN ZHIJIE (CN)
GENG ZHIMING (CN)
ZHANG JIAN (CN)
SHEN ZHIJIE (CN)
GENG ZHIMING (CN)
ZHANG JIAN (CN)
Application Number:
PCT/CN2017/090508
Publication Date:
January 11, 2018
Filing Date:
June 28, 2017
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L23/31; H01L21/56; H01L23/492; H01L23/522
Foreign References:
| CN105977225A | 2016-09-28 | |||
| CN206098376U | 2017-04-12 | |||
| CN1971925A | 2007-05-30 | |||
| CN103972256A | 2014-08-06 | |||
| CN101118882A | 2008-02-06 | |||
| CN103985723A | 2014-08-13 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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