Title:
PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/243880
Kind Code:
A1
Abstract:
Provided in the present application are a packaging structure and a packaging method. The packaging structure provided in the present application comprises: a packaging substrate and a rewiring layer arranged on the packaging substrate, wherein the packaging substrate comprises: several device regions, wherein a channel set is arranged in the each of the device regions, and the channel set is used for connecting an electronic device; the rewiring layer is used for leading out a channel subset to be protected needing electrostatic protection in the channel set to a preset region on the packaging substrate, so that all or some channels in the channel subset to be protected form a series circuit in the preset region, and the series circuit is used for connecting to an electrostatic discharge end. The packaging structure provided by the present application can carry out electrostatic protection on a channel needing to be protected in a packaging process.
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Inventors:
LENG HANJIAN (CN)
WU BAOQUAN (CN)
LONG WEI (CN)
WU BAOQUAN (CN)
LONG WEI (CN)
Application Number:
PCT/CN2019/089832
Publication Date:
December 10, 2020
Filing Date:
June 03, 2019
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L23/60; H01L23/485
Foreign References:
| CN109449140A | 2019-03-08 | |||
| CN103531580A | 2014-01-22 | |||
| CN101325164A | 2008-12-17 | |||
| CN101325164A | 2008-12-17 | |||
| CN205486157U | 2016-08-17 | |||
| US20110089540A1 | 2011-04-21 |
Other References:
See also references of EP 3799119A4
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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