Title:
PACKAGING STRUCTURE OF MICRO LIGHT EMITTING DIODE ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/214193
Kind Code:
A1
Abstract:
A packaging structure of a micro light emitting diode array substrate, comprising a substrate (1), micro light emitting diode arrays (3) disposed on the substrate (1), and a protection layer (2) disposed above the substrate (1) and covering the micro light emitting diode arrays (3); each micro light emitting diode array (3) comprises a plurality of micro light emitting diodes (31) arranged in array; a plurality of grooves (51) is provided on the upper surface of the substrate (1) or on the lower surface of the protection layer (2); the plurality of micro light emitting diodes (31) are accommodated in the plurality of grooves (51). The micro light emitting diodes (31) and the substrate (1) located below the micro light emitting diodes (31) for driving same can be protected, and the light emitting effect of a micro light emitting diode array substrate can be improved.
Inventors:
CHEN LIXUAN (CN)
Application Number:
PCT/CN2017/089084
Publication Date:
November 29, 2018
Filing Date:
June 20, 2017
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L33/54; H01L33/52
Foreign References:
| CN101246880A | 2008-08-20 | |||
| US20120049235A1 | 2012-03-01 | |||
| CN102709479A | 2012-10-03 | |||
| CN104505465A | 2015-04-08 | |||
| CN1589074A | 2005-03-02 |
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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