Title:
PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/168518
Kind Code:
A1
Abstract:
Provided are a packaging structure and a preparation method therefor, wherein same relate to the technical field of microelectronic packaging, and are used for solving the problem that solder will penetrate through a crack on a solder resist layer after being melted. The packaging structure comprises a chip and a substrate for carrying the chip. A first surface of the substrate is covered with a first insulating layer, the substrate is provided with a first pad on an inner side of the first insulating layer, a first opening is provided in the first insulating layer, and the bottom of the first opening leads to the first pad. The substrate further comprises a first conductive stop, wherein the first conductive stop blocks the bottom of the first opening, and same is electrically connected to the first pad; and the height of the first conductive stop in the first opening is less than the depth of the first opening.
Inventors:
LAW LAP TAK EDWARD (CN)
GUO JIANWEI (CN)
HU XIAO (CN)
WANG SHENGPING (CN)
GUO JIANWEI (CN)
HU XIAO (CN)
WANG SHENGPING (CN)
Application Number:
PCT/CN2019/075726
Publication Date:
August 27, 2020
Filing Date:
February 21, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/11; H05K3/46; H01L21/44
Foreign References:
| US20140138134A1 | 2014-05-22 | |||
| US20130192877A1 | 2013-08-01 | |||
| CN1535103A | 2004-10-06 | |||
| US20080029894A1 | 2008-02-07 | |||
| US20100288549A1 | 2010-11-18 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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