Title:
PACKAGING STRUCTURE FOR PACKAGING OF SUBSTRATE STORAGE RECEPTACLE
Document Type and Number:
WIPO Patent Application WO/2014/184845
Kind Code:
A1
Abstract:
This packaging structure (1) for packaging of a substrate storage receptacle (2) is provided with a packaging carton (10), an upper shock-absorbing material (30), a lower shock-absorbing material (40), a first rigid body (50), and a first cushion material (60). The first rigid body (50) is a first rigid body (50) arranged inside the packaging carton (10), and having a tabular shape having an upper surface (51) and lower surface (52) which are respectively flat, the upper surface (51) of the first rigid body (50) abutting the lower end surface of the lower shock-absorbing material (40). The first cushion material (60) is a first cushion material (60) arranged inside the packaging carton (10) and having an upper surface (51) and lower surface (52), the upper surface (62) of the first cushion material (60) abutting the lower surface (52) of the first rigid body (50) so as to be slidable with respect to the lower surface (52) of the first rigid body (50).
Inventors:
KANAMORI YUTA (JP)
Application Number:
PCT/JP2013/063295
Publication Date:
November 20, 2014
Filing Date:
May 13, 2013
Export Citation:
Assignee:
MIRAIAL CO LTD (JP)
International Classes:
B65D85/86; B65D81/07
Foreign References:
| JP2007137454A | 2007-06-07 | |||
| JP2004168324A | 2004-06-17 | |||
| JP2007197011A | 2007-08-09 | |||
| JP2008150067A | 2008-07-03 | |||
| JPH07307378A | 1995-11-21 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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