PACKAGING STRUCTURE

WIPO Patent Application WO/2023/207482

A1

Provided is a packaging structure, which may comprise a casing and a power assembly, the power assembly being arranged in the casing. The casing may comprise a top cover and a bottom casing, the top cover and the bottom casing being in butt joint to form the casing; and a first heat exchange medium channel may be arranged in the top cover, and a second heat exchange medium channel may be arranged in the bottom casing, the first heat exchange medium channel and the second heat exchange medium channel being respectively used for communicating with an external heat dissipation circulation system. The power assembly may comprise a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board may be oppositely arranged, the first circuit board may be arranged on the top cover, and the second circuit board may be arranged on the bottom casing. At least one first heating device may be arranged on the first circuit board, and the first heating device may abut against the inner wall of the top cover. At least one second heating device may be arranged on the second circuit board, and the second heating device may abut against the inner wall of the bottom casing. When the above structure is used, relatively high power density and relatively high heat dissipation efficiency may be achieved.

CUI ZHAOXUE (CN)
LIU REN (CN)
DU LIN (CN)
LIANG TAO (CN)
LI PING (CN)

PCT/CN2023/084491

November 02, 2023

March 28, 2023

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HUAWEI DIGITAL POWER TECH CO LTD (CN)

H05K7/20; H02M1/00

CN217957565U	2022-12-02
CN113939152A	2022-01-14
CN109413958A	2019-03-01
CN101944834A	2011-01-12
CN110022668A	2019-07-16
CN113286498A	2021-08-20
CN210579859U	2020-05-19
US20190263280A1	2019-08-29

TDIP & PARTNERS (CN)

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