Title:
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2020/185016
Kind Code:
A1
Abstract:
An embodiment relates to a packaging substrate and a semiconductor device, the semiconductor device comprising: an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit, wherein a glass substrate is used as the core of the packaging substrate so as to achieve a closer connection between the semiconductor element and a motherboard, thereby allowing an electrical signal to be transmitted over as short a distance as possible. Accordingly, provided is a packaging substrate which can significantly improve electrical characteristics such as signal transmission speed, can substantially prevent the occurrence of a parasitic element and thus more simplify the insulation layer treatment process, and can be applied to a high-speed circuit.
Inventors:
KIM SUNGJIN (US)
RHO YOUNGHO (KR)
KIM JINCHEOL (KR)
JANG BYUNGKYU (KR)
RHO YOUNGHO (KR)
KIM JINCHEOL (KR)
JANG BYUNGKYU (KR)
Application Number:
PCT/KR2020/003476
Publication Date:
September 17, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
SKC CO LTD (KR)
International Classes:
H01L23/15; H01L23/13; H01L23/367; H01L23/48; H01L23/485; H01L23/498; H01L23/50; H01L23/525; H01L23/538
Foreign References:
| JP2017050315A | 2017-03-09 | |||
| JP2017216398A | 2017-12-07 | |||
| US20180240778A1 | 2018-08-23 | |||
| US9768090B2 | 2017-09-19 | |||
| JP2014045026A | 2014-03-13 | |||
| KR20190008103A | 2019-01-23 | |||
| KR20160114710A | 2016-10-05 | |||
| KR101468680B1 | 2014-12-04 |
Other References:
See also references of EP 3916771A4
Attorney, Agent or Firm:
CHUNG, Hwaseung (KR)
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